iMAPS New England Chapter
International Microelectronics Assembly and Packaging Society
Symposium & Expo

Previous Symposium & Expo

2015 Symposium & Expo
May 5, 2015

Technical Program

More Previous Symposium & Expo Information Coming Soon...
2016 Symposium and Expo
iMAPS New England 43rd Symposium & Expo
Tuesday May 3, 2016

At the Holiday Inn Conference Center, Boxborough, Massachusetts

Symposium Technical Chair - Dmitry Marchenko – Microsemi

The Symposium Technical Program Committee has begun work on the 2016 Confab and is actively soliciting papers, posters, panel discussions, and novel formats for sharing the latest in microelectronics assembly and packaging technologies. To join our team and participate in developing the program structure or content, contact Dmitry Marchenko:

2016 Call for Papers
2016 Symposium EarlyBird Exhibitor Registration Form
2016 Symposium Technical Program – to be added
2016 Symposium Attendee Registration – to be added
2016 Symposium Flyer – to be added

Plus... Microwave Packaging Technology - A Professional Course Offered by TJ Green Associates, May 4-6, 2016 at the Holiday Inn Boxborough, Massachusetts