Our
History
The New England Chapter of iMAPS, formed in 1970 and chartered in 1972, is
the largest chapter in the United States, indeed, in the entire society.
Our current membership is approximately 600 individual plus 60 corporate
members and growing. Our current Chapter President is Mark Occhionero. We are
fortunate and proud to have the largest active chapter committee in the society
working to provide outstanding program and service to our membership. The
members of the Executive Committee and Operating Committees plus other
individuals serving the chapter are listed on our Committee Information page.
If you are interested in serving on one of our committees or would like to
devote some time to handling specific tasks in publicity, arrangements,
registration, newsletter or some other function, contact one of the committee
chairs or the chapter president. We never turn down anyone who wants to get
involved.
Originally formed in 1967 under the name ISHM (International Society for
Hybrid Microelectronics), our society merged in 1997 with IEPS (International
Electronic Packaging Society) to form what we now know as iMAPS (International
Microelectronics and Packaging Society). The society has a long tradition
of fostering development, supporting education and disseminating information
concerning all of the microelectronics technologies and providing forums
for presentation of technological advances. The parent society annually conducts
numerous Advanced Technology Workshops and The International Symposium on
Microelectronics. In the year 2003, The 36th International Symposium on
Microelectronics was held in Boston and a number of your chapter committee
members served along with other New England volunteers on the Steering Committee.
iMAPS also supports education through its Student Chapter program and grants
provided to individual students through The iMAPS Educational Foundation.
For 30 consecutive years, our chapter has conducted The Annual New England
Symposium & Exhibition. It is widely regarded as the largest and most
prestigious regional microelectronics symposium held anywhere. In addition,
iMAPS New England organizes six or seven informative technical meetings or
plant tours each year. In order to stress the importance of getting to know
our colleagues, one hour of each meeting is devoted strictly to socializing
and networking with other participants. This hour enables members to discuss
emerging technologies, career issues and market developments. We regularly
hold joint meetings with chapters of other related technical societies to
broaden our understanding of the industry as a whole. For several years we
have organized joint meetings with The New England Section of AcerS [the
American Ceramic Society] and The Boston Chapter of SMTA [Surface Mount
Technology Association]. These joint meetings have been so successful that
we plan to continue in future years. Check our Calendar Page for more information
on Chapter and Society events.
The month of May is an important one for iMAPS New England. It's then that
we conduct our Annual Symposium & Exhibition. Representatives from all
around the world and many of our sister chapters travel to New England in
order to present papers, exhibit, and attend. There are typically six to
eight technical sessions, 85 exhibition booths, a luncheon, Ors d'oeuvres
in the exhibit hall, and raffles prizes donated both by exhibitors and the
chapter, that go to lucky winners throughout the afternoon. It's an exciting
day of exposure to new technology mixed with a dash of fun.
The New England Chapter of iMAPS has always stressed the importance of technical
advancement and knowledge, along with an enjoyable time. We think the combination
is what makes our chapter unique and successful in the recruitment of quality
leaders and new members making our meetings informative and stimulating.
We invite anyone in our area, or visitors planning to be in the area, to
attend one of our meetings. Upcoming meetings are listed on the Events Section
of our home page. Meeting topics are added to the schedule and updated as
they are identified and confirmed by The Technical Program Committee.
Send all questions or comments to the
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