New England IMAPS Chapter

Keynote Presentation

"What The Future Holds For Tier ll & llI Electronic Manufacturing Service Providers"

Steven Corbett /CEO Cookson Electronics Providence, RI

ABSTRACT How does the small to medium sized electronics manufacturer survive in today’s global environment? Where can these companies find growth opportunities here in the USA?

The landscape of printed circuit board manufacturers and board assembly shops has undergone a radical change over the last 5-6 years. The migration to Mexico, Eastern Europe and Asia accelerated significantly during the industry downturn in 2001 and in the period following September 11, 2001. This shift in the manufacturing base resulted from the desire to leverage low cost labor in these markets but also, particularly in Asia, to leverage lower cost raw materials and electronic components.

If your company still has high volume electronics fabrication or assembly business where labor cost makes up a significant portion of the total cost – you are at serious risk of losing your business to offshore competition.

In my Keynote speech, I’ll detail the steps companies should take to analyze their current product portfolio to identify the types of products at risk of flight, and of course, the products and services at a significantly reduced risk of migration. In addition, I’ll give a few examples of electronic growth markets here in the USA that are unlikely to move offshore any time soon.

Mr. Corbett is the Chief Executive Officer of Cookson Electronics with global responsibility for the Electronics Division of Cookson Group Plc. Prior to assuming the CEO position in 2003; Mr. Corbett held various leadership positions throughout Cookson, starting from Technical Manager for Assembly Materials Group in 1990 to President of Enthone (a division of Cookson Electronics) in 2002.

Prior to joining Cookson, Mr. Corbett held technical and general management positions with Corning Glass from 1980 to 1983, and was affiliated with Heraeus GmbH, from 1983 to1990.

Mr. Corbett holds a degree in Chemical Engineering from the University of Vermont. He has numerous technical publications and holds patents.

Technical Program

On-Site Registration Opens 8:00 AM

Symposium Starts 9:00 AM

Expo Opens at 9:00 AM