at the
Holiday Inn Boxborough Woods, Boxborough MA

Exhibitors Registration (word)

On-Line Registration

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Registration and Badge Pickup Opens at 8:00 AM

Technical Program as of 3-Apr-2008

Session A: Ceramics (Sponsored by ACerS)

Session B: Cavity Plastic Packaging

Session C: Surface Mount Technology

Session D: Posters

Session E: Optics and Optoelectronics

Session F: Microwave and RF

Session G: Thermal Management

Session A: Ceramics (Sponsored by ACerS) 
9:00 AM - 11:45 PM
Chair: Jun Wang - Saint-Gobain, Northboro, MA 

“Synthesis of High Performance Ultra-Thin Solid State Oxide Electrolytes at Low Temperatures,”
Masaru Tsuchiya and S. Ramanathan, Harvard University, Cambridge, MA

“Development of Low-Loss and Perpendicularly Oriented Hexaferrites for Self-Biased Microwave Devices,”
Yajie Chen, C. Vittoria, and V.G. Harris, Northeastern University, Boston, MA

“Electrochemical Properties of Nanoscale Oxide Ceramic Conductors: Yttria Doped Zirconia and Gadolina Doped Ceria,”
A. Kartekeyan and S. Ramanathan, Harvard University, Cambridge, MA

“Constrained Sintering of LTCC Materials,”
Aravind Mohanram, S-H Lee, G.L. Messing, and D.J. Green, Saint-Gobain, Northboro, MA

“Structure-Functional Property Relationships in RF-Sputtered Vanadium Dioxide Thin Films,”
Dmitry Ruzmetov, K.T. Zawilski, V. Narayanamurti, and S. Ramathan, Harvard University, Cambridge, MA

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Session B: Cavity Plastic Packaging 
9:00 AM - 11:45 PM
Chair: Ken Gilleo - ET Trends, Warwick, RI

“Review of Particle Contamination in Electronic Packaging Manufacturing,”
Lewis Hecht, LC Hecht Consulting, Vestal, NY

“Liquid Crystal Polymer in the New Age of Electronic Packaging,”
John W. Roman, RJR Polymers Inc., Oakland, CA

“Plastic Air Cavity Package Achieves True Hermetic Performance,”
Christopher Lee, Quantum Leap Packaging, Inc., Wilmington, MA

“MEMS WLP Shrink,”
Jack Martin and H. Yun, Analog Devices, Inc., Cambridge, MA

“Silicon Wafer Level Packaging,”
Eric Leonard, Hymite Corporation, Rockwall, TX

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Session C: Surface Mount Technology
9:00 AM - 11:45 PM
Chair: Tom Garcia – GSI Group, Inc., Natick, MA

“Correlating Printing Process Defects to End of Line Defects,”
Vatsal Shah, Speedline Technologies, Franklin, MA

“Soldering Atmosphere Impact on Solder Joint Formation,”
Denis Barbini, PhD  and Ursula Marquez de Tino, Vitronics Soltec, Stratham, NH

“A Comparison of Different Mechanical Testing Techniques on the Reliability of Pb-Free Assemblies,”
S. Athavale, Daryl Santos, F. Mirza, E. Cotts, and J. Pitarresi, The State Univeristy of New York at Binghamton, Binghamton, NY

 “Lead-Free Assembly Challenges for Laminate Materials: Problems, Solutions & Needs,”
Ed Kelley, Isola Group, Londonderry, NH

“SMT Manufacturing Controls for Pb-Free Compliant Product,”
Scott  Mazur, Benchmark Electronics, Inc., Hudson, NH

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Buffet Luncheon from 12:00 to 1:30 PM

Raffles & Prizes 1:30 to 4:30 PM

Session D: Posters  
All Day Viewing / with Authors 2:30 - 4:00 PM
Chair: Tom Marinis - Draper Lab, Cambridge, MA; & Wei Han – Gillette, Boston, MA

“Material Topographic Influence on High Frequency Conductor Loss,”
Tracey Vincent, Worcester Polytechnic Institute, Worcester, MA

“Fabrication and Electrical Properties of Multi Walled Carbon Nanotubes – Polymer Nanocomposites,”
Ashok Pachamuthu, J. Chimuga, W. E. Jones,  and D. Santos, State University of New York at Binghamton, Binghamton, NY

“Conducting Polymer Nanocomposites Containing Multiwalled Carbon Nanotubes (MWCNTs),”
Jasper Chiguma, A. Pachamuthu, D. Santos, and W.E. Jones, Jr, State University of New York at Binghamton, Binghamton, NY

“Thermal Properties of Single and Multi-wall Carbon Nanotubes,”
Nihar R. Pradhan, H. Duan, J. Liang, and G.S. Iannacchione, Worcester Polytechnic Institute, Worcester, MA

“Template Assisted Fabrication of Protein and Polymer Nanostructures for Biomedical Applications,”
Shelley Dougherty and J. Liang, Worcester Polytechnic Institute, Worcester, MA

“Fabrication of Nanostructured Electrodes Based on Cu Nanorod Arrays for Li-ion Batteries,”
Xiangping Chen, Huanan Duan, Zhentao Zhou, and Jianyu Liang,  Central South University of Technology, Guangzhou, Guangdong, China, and Worcester Polytechnic Institute, Worcester, MA

“An Electro-Optically Tunable Optical Filter with an Ultra-large Wavelength Tuning Range,”
Rohit Samarth, Xuejun Lu, and Lei Zheng, Center for Electromagnetic Materials and Systems, University of Massachusetts Lowell, Lowell, MA

“Submicron Scale Patterning of Silver Using Visible Light Interference,"
Abhishek Kumar, Subhalakshmi Nagarajan, Ke Yang, A. Robinson, Ramaswamy Nagarajan, Aloke Jain and Jayant Kumar, University of Massachusetts Lowell, Lowell, MA

 “Synthesis and Characterization of Multifunctional Nanowires for Sensor and Electronics Applications,”
Erica Chin, Fan Gao, Subhadeep S. Mukherjee, and Zhiyong Gu, University of Massachusetts Lowell, Lowell, MA

“Role of Virtual Reality Based Training in Roll-To-Roll Manufacturing of Flexible Electronics,”
Abhinesh Bhuvanesh, M. T. Khasawneh, and S. S. Lam, State University of New York at Binghamton, Binghamton, NY

“A Roll-to-Roll Photolithography Process for the Fabrication of Large Area Flexible Interdigitated Electrodes,”
Hao Zhang, Mark D. Poliks and Bahgat Sammakia, Center for Advanced Microelectronics Manufacturing, State University of New York at Binghamton, Binghamton, NY

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Session E: Optics and Optoelectronics
1:00 PM - 3:00 PM
Chair: Robert W. Sprague, Barr Associates, Westford, MA

“New Exciting Advances and Applications of Microdisplays,”
Hong Choi, Kopin Corporation, Taunton, MA

“Optical Thin Film Filters Fabricated Using Rugate Technology at Barr Associates,”
Robert  W.  Sprague, Barr Associates, Westford, MA

“Fiber Optic Interconnectivity in Mil/Aero Applications,”
Anthony J. Christopher, Ksaria Corporation, Lawrence, MA

“Development of a Buoyant Optical Fiber,”
Stephen  O’Riorden and A. Mahapatra, Linden Photonics, Inc., Westford, MA

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Session F: Microwave and RF
1:00 PM - 3:00 PM
Chair: Tracey Vincent  and Huanan Duan - Worcester Polytechnic Institute, Worcester, MA

“Theoretical Development for the Design of Thermal Via Size and Density within LTCC,”
Mike Ehlert & Peter Barnwell, Barry Industries, Attleboro, MA, & T. Vincent, Worcester Polytechnic Institute, Worcester, MA

“PCB Topographic Influence on GHz Frequency Loss,”
Tracey Vincent, C.A. Brown, and I. Bar-On, Worcester Polytechnic Institute, Worcester, MA

“Microwave Photonic Links with Intrinsic Gain and Low Noise Figure,”
Chris Janson, Photonic Systems, Inc., Billerica, MA

“Polyimide Substrate for Advanced Photonic and Electronic Packaging and MEMS”
John Farah, OptiCOMP Networks, Inc., Attleboro, MA

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Session G: Thermal Management
1:00 PM - 3:00 PM
Chair: Henry Villaume - Villaume Associates LLC, Intervale, NH

“Commercially Available Grades of Pyrolytic Graphite,”
Robert Marchiando, Momentive Performance Materials, Strongsville, OH

“The Thermal Design of an LED Commercial Florescent Tube,”
Logan Hedin, Tenhex Inc., San Francisco, CA; G. Arnold, Cool Polymers, Warwick, RI

“Increasing Heat Loads and Heat Densities are Creating the Need for Low Cost Effective Heat Spreaders- Here is Comparative IR Performance Data for a Number of PSA Applied Materials,”
Jeff Panek, Cool Shield, Inc., Warwick, RI

“A General Solution Framework for LED Cooling Problems,”
Michael Denninger, Luminus Devices, Billerica, MA

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Advanced Packaging - Official Media Sponsor of The 2008 Symposium

On-Line Registration