Technical Program Chair – Delip Bokil
Session
Chairs & Co-Chairs - Dave Saums, Wei Han, Ryan Marinis, Jim Alexander,
Amaresh Mahapatra, Thomas Garcia, Henry
Villaume, Ken Gilleo, Dave Gibson, Tom Marinis, Tom Ollila Bo Gu, Rita Mohanty
Keynote Presentation - "What The Future Holds For Tier ll & llI Electronic Manufacturing Service Providers"
Steven Corbett /CEO Cookson
Electronics Providence, RI
Preliminary List
of Presentations
“Using High
Volume Electronics Manufacturing Technology To Develop A High Volume Fuel Cell
Manufacturing Process”
Joe Belmonte,
Speedline Technologies
“The Economics
Of Photovoltaics”
Alan Goodrich,
IBIS Associates, Inc
“Simulation Of
Fuel Cell Production Line”
Sudeep
Nambiar, Speedline Technologies
“Development Of
LTCC Based Miniaturized Combustors”
Jorge
Santiago, University
of Pennsylvania
“Dimensional
Control Of Dupont 943 LTCC Green Tape™ For High Frequency Applications”
Carl Wang,
DuPont Microcircuit Material
“A
Techno-Economic Analysis Of Competing IC Packaging Technologies”
Alan Goodrich,
IBIS Associates, Inc
“Nano-Structured
Surface Engineering For Biomedical Implants”
Joe Hernandez,
Worcester Polytechnic Institute
“Hermetic Wafer
Scale Packaging Of MEMS Devices”
Eric Leonard
“Carbon
Nanotube Arrays For Solder-Free Packaging”
Jianyu Liang,
Worcester Polytechnic Institute
“A Review Of
Literature On Carbon Nanotube Polymer Composites”
Daryl Santos, Binghamton University
“Laser
Technology And Applications For Microelectronics Industry”
Bruce Couch,
GSI Group
“Miniature,
High Strength Optical Tether Cable”
Robert
Mansfield, Linden
Photonics
“A Cool New Way
To Mold Infrared Lenses”
Bill
Plummer, WTP Optics, Inc.
“Thin, Planar
Copper On AlN For Optoelectronic Packaging”
Derek
Richardson, Stellar Inds
“Precision
Laser Processing For Micro Electronics And Fiber Optic Manufacturing’
Andrew Webb,
OpTek Systems Inc.
“Optimal
Roughness For Minimum Stiction”
Deli Liu,
Worcester Polytechnic Institute
“Self-Regulating
Microhotplate”
Christopher
Marinis, Northeastern University
“Metal Magnetic
Thin Film Materials And Micro-Devices For RF/Microwave Applications”
Nian Sun, Northeastern University, Department of Electrical
& Computer Engineering
“Applying SPC
To Surface Mount Manufacturing”
Dr. Ronald
Lasky, Indium Corporation/Dartmouth
College
“A Comparative
Study Of Mechanical Testing Reliability Techniques For Pb-Free Electronics
Assemblies”
Daryl Santos, Binghamton University
“Process
Development For 01005 Lead-Free Passive Assembly: Printing And Inspection”
Vatsal Shah,
Speedline Technologies
“Practical
Application Guidelines For Vapor Chambers”
George Meyer,
Celsia Technologies Inc.
“Thermal
Designs For LED Modules Being Used In Trak Lighting Applications”
Michael
Miskin, LYNK LABS
“Applications
For Plastic Heat Sinks”
Mark
Mozgowiec, Wakefield
Thermal Solutions
“Thermal
Interface Material Testing In Practice And Future”
David Saums,
DS&A LLC
Holiday
Inn Boxborough Woods, Boxborough MA
On-Site
Registration Opens 8:00 AM
Symposium
Starts 9:00 AM
Expo
Opens at 9:00 AM
