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iMAPS New England Chapter |
Tuesday May 3rd 2016
Holiday Inn Boxborough Woods, Boxborough, MA
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Session A:
RF and Microwave - Innovations & Emerging Technologies Session Chairs: Tom Terlizzi , and Dr. Tracey Vincent
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Investigation of Electromagnetic Field Coupling from DC-DC Buck Converters to Automobile AM/FM Antennas
Abstract Presentation Patrick DeRoy , CST, Framingham, MA |
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ECLIPS: Embedded Cooling Layer – Integrated Power System Abstract Presentation Al Wasserzug, Cirexx International, Louisville, KY
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High Dielectric Constant, Low Loss Additive Manufacturing Materials for RF/Microwave Applications Abstract Presentation Caprice Gray , Draper, Cambridge, MA
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How to Simulate RF Materials Considering Accuracy and Speed Abstract Presentation Dr. Tracey Vincent, CST, Framingham, MA
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100nm GaN on Si: A Pioneering Technology to Enable High RF Power in Millimeter Wave Bands Abstract Presentation Craig Vieira , Ametek-ECP, New Bedford, MA
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100nm GaN on Si: A Pioneering Technology to Enable High RF Power in Millimeter Wave Bands Abstract Presentation Timothy J. Flaherty, Golden Altos Corporation, Milpitas, CA
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Session B: High Reliability Interconnects Session Chairs: Mike McKeown and Bill Boyce
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Heavy Copper Wire Bonding for Mass Production Abstract Presentation Mike McKeown, Hesse Mechatronics, Mineola, NY
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Understanding the Role of Ultrasonic Welding in Wire Bonding Abstract Presentation Lee Levine , Process Solutions Consulting, Inc., New Tripoli, PA
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Configurations for Robust Gold Stitch-to-Substrate Wire Bond Attachment Abstract William Boyce, Smart Microsystems, Elyria, OH
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Process Optimization on Advanced Al Wirebond Tools Abstract Presentation Matthew Kurtz, Rochester Electronics, Newburyport, MA
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Submicron Au Particles for Low Temperature Au to Au Bonding Abstract Presentation William (Bud) Crockett, Tanaka Kikinzoku Kogyo K.K., San Jose, CA
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Wire Bonding onto Niobium for Superconducting Applications Abstract Presentation Dr. Michael Hamilton, Auburn University, Auburn, AL; Mike McKeown, Hesse Mechatronics, Mineola, NY
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Session C: SMT and Electronics Packaging Session Chairs: Tina Barcley and Mike Martel
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Improving Electronics Assembly Process Through Organic-Metal Final Finish Abstract Presentation Dr. Rita Mohanty, Enthone, Waterbury, CT
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Extreme Long Term Printed Circuit Board Surface Finish Solderability Assessment Abstract Presentation Paper Gerard O'Brien, D. Hillman – STandS Group, Richmond, KY
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Flexible Electronics – Packaging Design Abstract Presentation Tina Barcley , TAS Consulting, Mendon, NY
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System Level Technical Analysis for EO Sensors Abstract Presentation Michael Meier, MJM & Associates, Rochester, NY
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Applying New Approaches to Emerging SMT PCB Stencil Printing Challenges Abstract Presentation Michael L. Martel , MMC Marketing, Bristol, RI
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Session D: Printed Electronics Session Chairs: James Zunino III and Katherine Duncan
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Application of inkjet printing technology
Abstract Presentation Michael Carr , New Jersey Institute of Technology, Newark, NJ
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Electrical Characterization of Traditional and Aerosol Inkjet Printed Conductors under Tensile and Strain Abstract Presentation Jake Rabinowitz , Northeastern University, Boston, MA
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Fully Printed Conformal Antenna and Sensors on 3D Plastic, Ceramic, and Metallic Substrates Abstract Presentation Mike O’Reilly , Optomec, Inc., Albuquerque, NM
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Next Flex - Flexible Hybrid Electronics Manufacturing Innovation Institute Abstract Presentation James Zunino III, U.S. Army RDE Command (ARDEC), Picatinny Arsenal, NJ
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America Makes and Status of Research in Multi-Functional Printing Abstract Presentation Dr. Eric MacDonald, University of Texas, El Paso, TX
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SuperScrypt - Next Generation Additive Manufacturing System Abstract Presentation C. Mike Newton , Sciperio / nScrypt, Orlando, FL
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Session E: Medical Device Packaging Session Chairs: Steve LaFerriere and Tom Green
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Hermetic Packaging of Implantable Devices: How did we get here? And where are we going?
Abstract Presentation Heather DunnCirtec Medical, Longmeadow, MA
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A Transistor-less, Wireless Neural Implant Abstract Presentation Dr. Daniel Freeman, Draper, Cambridge, MA
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RF companion chip based on PICS technology for small and reliable medical device packaging: application to Ultra-Low Power RF Implants Abstract Presentation Dr. Mohamed Mehdi Jatlaoui , IPDiA, Caen Area, France
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Packaging Architecture for an Implanted System that Monitors Brain Activity and Applies Therapeutic Stimulation Abstract Presentation Caroline Bjune, Draper, Cambridge, MA
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Electronics Packaging Methods and Materials for Implantable Medical Devices Abstract Presentation Susan Bagen, Micro Systems Technologies, Inc, Mesa, AZ
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Session F: 3D and Beyond Session Chairs: Maria Durham , and Dr. A.F. M. Anwar
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Room Temperature Fast Flow Reworkable Underfill for LGA Abstract Presentation Dr. Wusheng Yin , YINCAE Advanced Materials, LLC, Albany, NY
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Beyond Chip Stacking---Quilt Packaging Enabled 3D Systems Abstract Presentation Jason Kulick , Indiana Integrated Circuits, South Bend, IN
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Challenges facing electrochemical deposition in wafer level packaging Abstract Presentation Thomas Richardson, – MacDermid Enthone Electronics Solutions, Waterbury, CT
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Liquid Metal Interconnects for Conformable Sensor Packaging Enabling Inertial Measurements of Animals and Soft Robots Abstract Presentation Nikolas Kastor, R.D. White – Tufts University, Medford, MA
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Printed Transceiver Circuit for System-on-chip Sensor and Processor Abstract Presentation Peter H Lewis, Draper, Cambridge, MA
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Session G: Nanoelectronics & Optoelectronics Packaging Session Chairs: Dr. Alkim Akyurtlu and Dr. Joey Mead
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Wafer Scale Integration of III-Vs (GaN) with Si CMOS for RF Applications Abstract Presentation Dr. Thomas Kazior, Raytheon Integrated Defense Systems, Andover, MA
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Synthesis and Preparation of Sn/Ag Nanosolder Paste for Micro/Nano-Electronics Assembly and Packaging Abstract Evan Wernicki , University of MA Lowell, Lowell, MA
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Scalable Nano and Microscale Printing of Sensors and Electronics Abstract Presentation Dr. Ahmed Busnaina, Northeastern University, Boston, MA
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Packaging of MEMS for Aerodynamic Measurements Abstract Presentation Dr. Robert White, Tufts University, Medford, MA
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Growth of Single Layer Thin Films of Graphitic Carbon Nitride A 2-D Semiconductor Material Using CVD Abstract Presentation Abdul M. Syed, M.M. Masaki, C.M. Dragun-Bianchi, & J. Therrien – University of Massachusetts Lowell, Lowell, MA
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Session H: Poster Session Session Chairs: Dr. Zhiyong Gu and Dr. Rita Mohanty
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High-resolution Inkjet and 3D Printing Abstract Presentation Yang Gou , University of Connecticut, Storrs, CT
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Fluorescent Carbon nano-particles (CNPs) for Explosive Sensing Abstract Sichen Zhang , University of Connecticut, Storrs, CT
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Thermogravimetric Study of Dicyandiamide for Application in CVD Growth Process of Single Layer Film of Graphitic Carbon Nitride (g-C?N?) Abstract Michael Masaki , University of MA Lowell, Lowell, MA
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Novel 3D Vertically Aligned Platinum Nanowire Array as Electrocatalysts for Direct Methanol Fuel Cells Abstract Daniel Chuqing Liu , University of MA Lowell, Lowell, MA
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Melting Behavior and Morphology Change of Metallic Nanowires Using Femtosecond Laser Irradiation Abstract Jirui Wang University of MA Lowell, Lowell, MA
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Counterfeit Component Prevention and Detection Abstract Scott Mazur Benchmark Electronics, Nashua, NH
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Photos of 2015 - 2016 Meetings - Photographer: Joseph W. Soucy
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Tuesday May 6th 2015
Holiday Inn Boxborough Woods, Boxborough MA
Call for Papers 2017
Earlybird Exhibitor Registration 2017
iMAPS - INTERNATIONAL MICROELECTRONICS AND PACKAGING SOCIETY