iMAPS New England Chapter

43rd Symposium & Expo
Tuesday May 3rd 2016
Holiday Inn Boxborough Woods, Boxborough, MA

Symposium Technical Program Chairs Dmitry Marchenko and Dr. Parshant Kumar

President's Welcome Letter

Welcome to IMAPS New England 43rd Annual Symposium and Expo - John Blum, New England IMAPS Chapter President

Technical Chair's Welcome Letter

Welcome Letter - Dmitry Marchenko and Dr. Parshant Kumar, Technical Program Chairmen

Symposium Program

Booklet - Abstracts, Vendors, and pictures

Keynote Speaker

Dr. Ahmed A. Busnaina
William Lincoln Smith Professor,
Distinguished University Professor,
& Director of NSF Nanoscale Science and Engineering Center for High-rate Nanomanufacturing,
Northeastern University
Trillion Sensors for Health Care


Session A:

RF and Microwave - Innovations & Emerging Technologies

Session Chairs: Tom Terlizzi , and Dr. Tracey Vincent

Investigation of Electromagnetic Field Coupling from DC-DC Buck Converters to Automobile AM/FM Antennas
Abstract   Presentation
Patrick DeRoy , CST, Framingham, MA

ECLIPS: Embedded Cooling Layer – Integrated Power System
Abstract   Presentation
Al Wasserzug, Cirexx International, Louisville, KY

High Dielectric Constant, Low Loss Additive Manufacturing Materials for RF/Microwave Applications
Abstract   Presentation
Caprice Gray , Draper, Cambridge, MA

How to Simulate RF Materials Considering Accuracy and Speed
Abstract   Presentation
Dr. Tracey Vincent, CST, Framingham, MA

100nm GaN on Si: A Pioneering Technology to Enable High RF Power in Millimeter Wave Bands
Abstract   Presentation
Craig Vieira , Ametek-ECP, New Bedford, MA

100nm GaN on Si: A Pioneering Technology to Enable High RF Power in Millimeter Wave Bands
Abstract   Presentation
Timothy J. Flaherty, Golden Altos Corporation, Milpitas, CA

Session B:

High Reliability Interconnects

Session Chairs: Mike McKeown and Bill Boyce

Heavy Copper Wire Bonding for Mass Production
Abstract   Presentation
Mike McKeown, Hesse Mechatronics, Mineola, NY

Understanding the Role of Ultrasonic Welding in Wire Bonding
Abstract   Presentation
Lee Levine , Process Solutions Consulting, Inc., New Tripoli, PA

Configurations for Robust Gold Stitch-to-Substrate Wire Bond Attachment
William Boyce, Smart Microsystems, Elyria, OH

Process Optimization on Advanced Al Wirebond Tools
Abstract   Presentation
Matthew Kurtz, Rochester Electronics, Newburyport, MA

Submicron Au Particles for Low Temperature Au to Au Bonding
Abstract   Presentation
William (Bud) Crockett, Tanaka Kikinzoku Kogyo K.K., San Jose, CA

Wire Bonding onto Niobium for Superconducting Applications
Abstract   Presentation
Dr. Michael Hamilton, Auburn University, Auburn, AL; Mike McKeown, Hesse Mechatronics, Mineola, NY

Session C:

SMT and Electronics Packaging

Session Chairs: Tina Barcley and Mike Martel

Improving Electronics Assembly Process Through Organic-Metal Final Finish
Abstract   Presentation
Dr. Rita Mohanty, Enthone, Waterbury, CT

Extreme Long Term Printed Circuit Board Surface Finish Solderability Assessment
Abstract   Presentation   Paper
Gerard O'Brien, D. Hillman – STandS Group, Richmond, KY

Flexible Electronics – Packaging Design
Abstract   Presentation
Tina Barcley , TAS Consulting, Mendon, NY

System Level Technical Analysis for EO Sensors
Abstract   Presentation
Michael Meier, MJM & Associates, Rochester, NY

Applying New Approaches to Emerging SMT PCB Stencil Printing Challenges
Abstract   Presentation
Michael L. Martel , MMC Marketing, Bristol, RI

Session D:

Printed Electronics

Session Chairs: James Zunino III and Katherine Duncan

Application of inkjet printing technology
Abstract   Presentation
Michael Carr , New Jersey Institute of Technology, Newark, NJ

Electrical Characterization of Traditional and Aerosol Inkjet Printed Conductors under Tensile and Strain
Abstract   Presentation
Jake Rabinowitz , Northeastern University, Boston, MA

Fully Printed Conformal Antenna and Sensors on 3D Plastic, Ceramic, and Metallic Substrates
Abstract   Presentation
Mike O’Reilly , Optomec, Inc., Albuquerque, NM

Next Flex - Flexible Hybrid Electronics Manufacturing Innovation Institute
Abstract   Presentation
James Zunino III, U.S. Army RDE Command (ARDEC), Picatinny Arsenal, NJ

America Makes and Status of Research in Multi-Functional Printing
Abstract   Presentation
Dr. Eric MacDonald, University of Texas, El Paso, TX

SuperScrypt - Next Generation Additive Manufacturing System
Abstract   Presentation
C. Mike Newton , Sciperio / nScrypt, Orlando, FL

Session E:

Medical Device Packaging

Session Chairs: Steve LaFerriere and Tom Green

Hermetic Packaging of Implantable Devices: How did we get here? And where are we going?
Abstract   Presentation
Heather DunnCirtec Medical, Longmeadow, MA

A Transistor-less, Wireless Neural Implant
Abstract   Presentation
Dr. Daniel Freeman, Draper, Cambridge, MA

RF companion chip based on PICS technology for small and reliable medical device packaging: application to Ultra-Low Power RF Implants
Abstract   Presentation
Dr. Mohamed Mehdi Jatlaoui , IPDiA, Caen Area, France

Packaging Architecture for an Implanted System that Monitors Brain Activity and Applies Therapeutic Stimulation
Abstract   Presentation
Caroline Bjune, Draper, Cambridge, MA

Electronics Packaging Methods and Materials for Implantable Medical Devices
Abstract   Presentation
Susan Bagen, Micro Systems Technologies, Inc, Mesa, AZ

Session F:

3D and Beyond

Session Chairs: Maria Durham , and Dr. A.F. M. Anwar

Room Temperature Fast Flow Reworkable Underfill for LGA
Abstract   Presentation
Dr. Wusheng Yin , YINCAE Advanced Materials, LLC, Albany, NY

Beyond Chip Stacking---Quilt Packaging Enabled 3D Systems
Abstract   Presentation
Jason Kulick , Indiana Integrated Circuits, South Bend, IN

Challenges facing electrochemical deposition in wafer level packaging
Abstract   Presentation
Thomas Richardson, – MacDermid Enthone Electronics Solutions, Waterbury, CT

Liquid Metal Interconnects for Conformable Sensor Packaging Enabling Inertial Measurements of Animals and Soft Robots
Abstract   Presentation
Nikolas Kastor, R.D. White – Tufts University, Medford, MA

Printed Transceiver Circuit for System-on-chip Sensor and Processor
Abstract   Presentation
Peter H Lewis, Draper, Cambridge, MA

Session G:

Nanoelectronics & Optoelectronics Packaging

Session Chairs: Dr. Alkim Akyurtlu and Dr. Joey Mead

Wafer Scale Integration of III-Vs (GaN) with Si CMOS for RF Applications
Abstract   Presentation
Dr. Thomas Kazior, Raytheon Integrated Defense Systems, Andover, MA

Synthesis and Preparation of Sn/Ag Nanosolder Paste for Micro/Nano-Electronics Assembly and Packaging
Evan Wernicki , University of MA Lowell, Lowell, MA

Scalable Nano and Microscale Printing of Sensors and Electronics
Abstract   Presentation
Dr. Ahmed Busnaina, Northeastern University, Boston, MA

Packaging of MEMS for Aerodynamic Measurements
Abstract   Presentation
Dr. Robert White, Tufts University, Medford, MA

Growth of Single Layer Thin Films of Graphitic Carbon Nitride A 2-D Semiconductor Material Using CVD
Abstract   Presentation
Abdul M. Syed, M.M. Masaki, C.M. Dragun-Bianchi, & J. Therrien – University of Massachusetts Lowell, Lowell, MA

Session H:

Poster Session

Session Chairs: Dr. Zhiyong Gu and Dr. Rita Mohanty

High-resolution Inkjet and 3D Printing
Abstract   Presentation
Yang Gou , University of Connecticut, Storrs, CT

Optical Approaches for Glucose Biosensing
Jun Chen , University of Connecticut, Storrs, CT

Screen-printed Electrode (SPE) based Solid-State pH Sensor
Qiuchen Dong

Fluorescent Carbon nano-particles (CNPs) for Explosive Sensing
Sichen Zhang , University of Connecticut, Storrs, CT

Protein Microspheres with Unique Autofluorescence for Non-invasively Tracking and Modelling of Their In Vivo Biodegradation
Xiaoyu Ma, University of Connecticut, Storrs, CT

Thermogravimetric Study of Dicyandiamide for Application in CVD Growth Process of Single Layer Film of Graphitic Carbon Nitride (g-C?N?)
Michael Masaki , University of MA Lowell, Lowell, MA

Novel 3D Vertically Aligned Platinum Nanowire Array as Electrocatalysts for Direct Methanol Fuel Cells
Daniel Chuqing Liu , University of MA Lowell, Lowell, MA

Melting Behavior and Morphology Change of Metallic Nanowires Using Femtosecond Laser Irradiation
Jirui Wang University of MA Lowell, Lowell, MA

Counterfeit Component Prevention and Detection
Scott Mazur Benchmark Electronics, Nashua, NH

Photos of 2015 - 2016 Meetings - Photographer: Joseph W. Soucy

Symposium May 5, 2015
Photos I
Photos II
Photos III

New England IMAPS December 11, 2015 Holiday Party
Page 1
Page 2

New England IMAPS February 9, 2016 Technical Meeting

New England IMAPS April 12, 2016 Technical Meeting

2016 Symposium Sponsors
Tuesday May 6th 2015
Holiday Inn Boxborough Woods, Boxborough MA
Call for Papers 2017
Earlybird Exhibitor Registration 2017
iMAPS New England Chapter