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iMAPS New England Chapter |
Tuesday May 2nd, 2017
Boxboro Regency Hotel, Boxborough, MA
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Session A:
Nanoelectronics & Optoelectronics Session Chairs: Yi Qian , MRSI Systems, and Jin Li , Cambridge Technology
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Grand Challenges and Timelines for Electronic-Photonic Integration
Abstract Presentation Lionel C. Kimerling , Massachusetts Institute of Technology, Cambridge, MA
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Standoff Chemical Sensing Wireless Network Abstract Presentation Xuejun Lu, University of Massachusetts Lowell, Lowell, MA
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Quantum Cascade Laser Power Scaling Developments Abstract Presentation Jeffrey Shattuck , Forward Photonics, Wilmington, MA
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Wafer-level Integration and Packaging of Micro-Concentrating Photovoltaics Abstract Presentation Juejun Hu, Lan Li, Duanhui Li, Tian Gu – Massachusetts Institute of Technology, Cambridge, MA; Bradley Jared, Gordon Keeler, Bill Miller, William Sweatt, Scott Paap, Michael Saavedra, Charles Alford, John Mudrick, Anna Tauke-Pedretti - Sandia National Laboratories, Albuquerque, NM; Ujjwal Das, Steve Hegedus, - Institute of Energy Conversion, University of Delaware, Newark, DE
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Challenges in Optical Sensor Module Packaging - Evolving from Past into Future Abstract Presentation Julia Ying Zhao, David Bolognia – Analog Devices, Inc., Wilmington, MA
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Automated Die Bonding for High Volume Optoelectronics Manufacturing: Speed, Accuracy, and Flexibility Abstract Presentation Peter Cronin, MRSI Systems, Billerica MA
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Session B: MEMS & Nano Systems Session Chairs: Robert White , Tuffs University and Rick Morrison , Draper
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Miniature Multiwire Systems (MMS) Abstract Presentation Caprice Gray Haley, Anthony Kopa, Andrew Magyar, Amy Duwel, Brian Smith, Sara Barron, Mitch Meinhold, and Seth Davis – Draper, Cambridge, MA
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A New Manufacturing Process for Fabricating 3D Interconnects for MEMS and ICs Abstract Presentation Cihan Yilmaz, PhD, Flex Boston Innovation Center, Boston, MA
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MEMS Packaging for Reliable, Low Pressure Sensing in Automotive Applications Abstract Sam MacNaughton, Matt Lasorsa, Giff Plume – Sensata Technologies, Attleboro, MA
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Low Temperature, Hermetic Packaging of a MEMS Electric Field Sensor Abstract Presentation Douglas Gauthier, Daniel Reilly, James Bickford, & Stephanie Golmon – Draper, Cambridge, MA
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Advanced Integration Program at BRIDG and the Reliability Issues with 2.5D / 3D Integration Abstract Presentation Amit Kumar, John Allgair – BRIDG, Neocity, FL
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Tuning the Resonance Frequency of Piezoelectric MEMS Microphones by Sizing Acoustic Ports Abstract Presentation Yu Hui, Jongsoo Choi, & Robert Littrell – Vesper MEMS, Boston, MA
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Session C: RF and Microwave: Innovations & Emerging Technologies Session Chairs: Tom Terlizzi , GM Systems LLC and Chandra Gupta , Communications & Power Industries, LLC
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Microwave and Millimeter Wave Multi-Chip Module Manufacturing Abstract Presentation Earle Stewart, HXI, LLC, Harvard, MA; David Robbins – Monzite Corp., Nashua, NH
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Challenges of Microwave Assembly Abstract Presentation Jay Chudasama, Agile Microwave Technology Inc., Hicksville, NY
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Design and Analysis of Antennas for a Modern Smartwatch Abstract Presentation Tracey Vincent, CST [Computer Simulation Technologies] - Framingham, MA
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Visual Identification of Organic Residue on Microelectronic Components via In-Process Visible Light Fluorescence Abstract Presentation Tristan Baldwin, Richard Rochford - BAE Systems, Nashua, NH
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Hermetic System-in-Package for High Power RF MEMS Switch Abstract Presentation Chris Keimel, Kaustubh Nagarkar – Meino Micro - Irvine, CA
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Device Physics Matters in RF Designs and Manufacturing Abstract Presentation Chandra Gupta, Communications & Power Industries, LLC, Beverly, MA
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Session D: Medical Device Packaging Session Chairs: Caroline Bjune , Draper and Steve LaFerriere , Yole Développement
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Embedding of Active Components in LCP for Implantable Medical Devices
Abstract Presentation Susan Bagen , MST [Micro Systems Technologies], Mesa, AZ 85210; Dr. Eckardt Bihler, Dr. Marc Hauer - Dyconex AG, Switzerland
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Low-Cost Electronically-Controlled Prostheses for Transfemoral Amputees Abstract Presentation Molly Berringer, Draper / MIT, Cambridge, MA
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The Use of Advanced Microelectronic Packaging Techniques to Miniaturize Implantable Neuro Stimulators Abstract Presentation Jim Ohneck, AEMtec/Exceet North America, Cleveland / Akron, OH
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Chromatic Mechanical Response in 2-D Layered Transition Metal Dichalcogenide (TMDs) based Nanocomposites Abstract Presentation Balaji Panchapakesan, Worcester Polytechnic Institute, Worcester, MA |
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Dragonfleye - Ultraminiature Cybernetic Insect Control Using Optogenetics Abstract Presentation Carlos Segura, Jesse Wheeler, Joseph Register, John Le Blanc, Parshant Kumar, Dennis Callahan, Charles Lissandrello, Aaron Stoddard, Andrew Czarnecki, Christopher Salthouse, Alexander Oliva, – Draper, Cambridge, MA
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Thread Based Sensors and Interconnects for Medical Diagnostics Abstract Presentation Meera Punjiya, Tufts University, Medford, MA
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Session E: Thermal Management Session Chairs: David Saums , DS&A LLC
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Automation of Die Attach of Si onto Cu using BondFlow (TM)
Abstract Presentation Richard Koba, Kent Hutchings – Materion, Tyngsboro, MA; Jim Fraivillig - Fraivillig Technologies, Boston, MA; Peter Cronin - MRSI Systems, North Billerica, MA
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Market, Regulatory, Packaging, and Thermal Design Issues for Implantable Medical, Handheld, and Mobile Devices Abstract Presentation David L. Saums, DS&A LLC, Amesbury, MA
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Efforts Toward a Board Level Holistic Thermal and EMI Solution for Mobile Electronic Devices Abstract Presentation Eugene Pruss, Jason Strader - Laird Technologies, Cleveland, OH
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Thermal Test Chip for Thermal Characterization and Qualification of Materials and Semiconductor Packages Abstract Presentation Mohamad Abo Ras, Berliner Nanotest und Design GmbH, Berlin, Germany
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Improved Heat Dissipation for High-Power Systems via Nanocopper-Based Metal SMT Abstract Presentation Alfred A. Zinn, Kuprion Inc. (Lockheed Martin), Palo Alto, CA
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Electronic Coolants for Liquid Chillers and Direct Refrigerant Chillers for Electronic Systems Abstract Presentation Randy Owen, K-O Concepts Inc., Titusville, FL
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Session F: Printed Electronics Session Chairs: Katherine J. Duncan ,Printed RF Structures Group and Craig Armiento , UMass Lowell
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Printing 3-D Nanostructures for Electronics and Sensors Applications Abstract Presentation Cihan Yilmaz, Flex Boston Innovation Center, Cambridge, MA
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Inkjet Printable Etching and Plating Resists Abstract Presentation Krishan Balantrapu, Dow Electronic Materials, Marlborough, MA
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3D Printing of Flexible and Stretchable Interconnects Abstract Presentation Mike O'Reilly, Optomec, Inc., Albuquerque, NM
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Use of 3D Printed Antennas for RF Energy Harvesting Purposes Abstract Presentation Charlotte Blair, ANSYS Inc., Middlebury, CT
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Printed Electronics and Additive Microelectronic Packaging for RF/Microwave Applications Presentation Craig Armiento,University of Massachusetts Lowell, Lowell, MA
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Session G: Poster Session Session Chairs: Tom Marinis , Draper and Amaresh Mahapatra, Linden Photonics, Inc.
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Fabrication and Characterization of Novel Low Inductance Micro-Coaxial Cables Abstract Daniela A. Torres, S.C Barron, A. Kopa, M.R Miller, A.P Magyar, P.H. Lewis, M.W. Meinhold, C.L. Gray - Draper, Cambridge, MA; R.D White - Tufts University, Medford, MA
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Optimal Design of Longitudinal-Fin Heat Sinks Accounting For Simultaneously Developing Flow and Conjugate Effects Abstract Georgios Karamanis, Marc Hodes - Tufts University, Medford, MA
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Drone Delivery of Cold Chain Medical Supplies Viability and Efficacy Abstract Michael Beinor, Evan Bosia, Scott Cazier, Keegan Train, Jianyu Liang, Gregory Fischer - Worcester Polytech Institute, Worcester, MA
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Verifying Electronic Component Cleanliness using Ion Chromatography Abstract Scott Mazur , Benchmark Electronics – NH Division, Nashua, NH
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Fabrication of Conformal Electronics Packaging with Microfluidic Eutectic Metal Interconnects Abstract Nikolas Kastor, Tufts University, Department of Mechanical Engineering, Medford, MA
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Photos of 2016 - 2017 Meetings - Photographer: Joseph W. Soucy
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Tuesday May 2nd, 2017
Boxboro Regency Hotel, Boxborough MA
Call for Papers 2018
2017 Symposium Exhibitors
Earlybird Exhibitor Registration 2018
iMAPS New England Chapter
2017 - 2018 NE IMAPS Executive Committee
iMAPS - INTERNATIONAL MICROELECTRONICS AND PACKAGING SOCIETY
