2026 SEP 24 iMAPS New England Weeknight Meeting
Joint Meeting with IEEE Microsystems & SMTA Boston
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“AI and Digital Twins for Microelectronics and Flexible Hybrid Electronics:
Design, Manufacturing, and Testing“
Presenter: Benyamin Davaji, Northeastern University
Design and manufacturing optimization in microelectronics and flexible hybrid electronics (FHE) still relies heavily on costly, time-consuming trial-and-error experimentation. We’ll introduce a physics-informed AI digital twin that predicts device structure and electrical performance directly from fabrication parameters, enabling virtual process development before fabrication. The framework combines deep learning with physics-informed neural networks (PINNs) that embed process-specific governing physics, improving accuracy, interpretability, and generalization across recipes, materials, and substrates. Validated on DUV photolithography, plasma etching, and printed FHE processes, the models predict geometry, material properties, conductivity, and frequency response using quantitative metrology data. Designed for bidirectional integration with EDA and TCAD workflows, the digital twin can be inverted to identify fabrication recipes that meet target device specifications while prioritizing the most informative experiments. The approach reduces development cycles and process exploration costs, enabling a transition from empirical optimization to physics-guided, AI-driven design, manufacturing, and testing.
Bio - Benyamin Davaji is an Assistant Professor of Electrical and Computer Engineering at Northeastern University, where his Autonomous Integrated MicroSystems (AIMS) Laboratory works on acoustic and ultrasound microsystems, bio-interfaces, and AI-driven digital twins for microsystem design and manufacturing. His research is supported by the NSF, DARPA, ARL, AFRL, AFOSR, and SEMI. He is a 2026 Hilton Head Rising Star of Microsystems and a FlexTech FLEXI Award recipient. He earned his Ph.D. from Marquette University and completed postdoctoral work at Cornell University.
The chapter graciously thanks Forgione Engineering, Inc for sponsoring this meeting.
SCHEDULE (times approximate)
5:30 PM Registration, Socializing, Networking
6:00 PM Dinner Served
6:45 PM Matt Bracy, President - Chapter Business Meeting - Introduction of Chapter Elections
7:00 PM Dmitry Marchenko, Nominating Committee Chair - Election of Chapter Officers
The Chapter Nominating Committee Submits the following Candidates for Chapter Office for 2027:
President: Richard Koba - Onto Technologies
Vice President: Sunny Agarwal, ITW EAE
Treasurer: Michael Curley - TTM Technologies
7:15 PM Matt Bracy, President - Adjourn Business Meeting & Introduction of Presentation
NEDC is hosting this meeting!
NEDC is hosting this meeting!
A note from our sponsor:
Since 2008, Forgione Engineering has delivered your requirements with more attention, innovation, and responsiveness than larger firms. Our results-focused, agile culture uncovers the underlying needs of a client base and efficiently translates those insights into meaningful products. Driven by a passion for success and love for problem solving, we use our resources, experience, and expertise to bring ideas to life.
Our most recent product, the Forgione Chip Tray Super Selector App Suite addresses failures on the factory floor in Microelectronics manufacturing that may seem like coincidence or random occurrences. However, many incidents stem back to the original lack of knowledge of the complete process downstream, and planning for package selection for transportation, protection, and presentations to automation equipment can be traced to be a root cause for many millions of dollars per year in scrap, rework, equipment damage, wasted resources and time, and program delays. Reduce die migration, ESD risk, handling damage, and more with data-backed selections of 2” and 4” chip trays and lids for bare die ICs, MMICs, filters, inductors, and other small, sensitive components. Our algorithm parses through a unified catalog of standard chip trays from Entegris and Gel-Pak to give you packaging options that prevent your components from flipping, migrating out of the pocket, excessive lateral rotation within pocket, and more of your packaging nightmares.
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