An Elevated Event ~ A New Location ~ Unprecedented Exposure

Why Present This Year?

Your voice, your presentations have never been more important than now.  With just two technical consecutive sessions the spotlight is a little brighter, the focus more on what you'll be bringing this year.

The leading regional confab on microelectronics just got a major upgrade. For our 52nd Annual Symposium, iMAPS New England is thrilled to be co-located with the IMAPS HQ Wire Bonding Workshop at our new venue in Woburn, MA.

For speakers, this is a rare opportunity to share your technical work, practical insights, and emerging approaches with a highly amplified audience. You will present to our dedicated, world-class New England microelectronics community while networking with the national and international industry leaders brought to town by the HQ event.

If you are advancing the design, assembly, and reliability of microelectronic and microsystem packaging, we want your voice on our stage. (Student submissions are highly encouraged!)

The Call for Abstracts

Focus Areas

We are seeking technical abstracts across the microelectronics assembly and packaging spectrum, including but not limited to:

• Advanced Packaging Architectures

• Heterogeneous Integration & Chiplet-Based Design

• High-Density Interconnects & Emerging Substrate Technologies

• Materials (Assembly, Interconnects, and Thermal Management)

• Printed Electronics, Materials, & Additive Methodologies

• Power Electronics Packaging

• Optoelectronics & Photonics Integration

NEW: Expanded Session Formats

This year’s program is breaking the mold of traditional lecture presentations. When you submit your abstract, you can optionally indicate your interest in participating in our new, highly interactive formats:

• Panel Discussions: Topic-driven sessions featuring multiple experts offering complementary perspectives.

• Technical Forums: Focused, interactive sessions designed for a deeper exploration of emerging challenges or cross-disciplinary issues.

• Keynote-Aligned Sessions: Abstracts that closely connect to the themes introduced by our keynote speakers may be selected for integrated, high-visibility programming.

Submission Guidelines

Submitting your work is simple—no full written paper is required.

The Rule: All submissions must possess strong technical merit and be completely free of commercial/sales content.

The Abstract: Provide a 100–200 word summary clearly stating your approach, results, and significance to the industry.

The Bio: Include a brief 50–100 word biography.

The Details: Include author names, affiliations, contact information, and note if the primary presenter is a student.

The Format: Indicate if your work is best suited for an oral presentation, a poster, or one of our novel session formats.

Ready to Share Your Expertise?

SUBMIT YOUR DETAILS BY CLICKING HERE