Call for Abstracts   -   The Leading Regional Confab on Microelectronics

Our Technical Committee seeks contributions that advance design, assembly, and reliability of microelectronic and microsystem packaging. You should present technical work, practical insights, or emerging approaches relevant to the microelectronics assembly and packaging community.

Student Submissions are encouraged.

Focus Areas

Technical abstracts are encouraged in, but not limited to, the following areas:

• Advanced packaging architectures

• Heterogeneous integration and Chiplet-based design

• High-density Interconnects and Emerging Substrate Technologies

• Materials for assembly, interconnects, and thermal management

• Printed Electronics, Materials and Additive Methodologies

• Power electronics packaging

• Optoelectronics and photonics integration

Novel Session Formats

This year’s program expands beyond traditional lecture presentations. Authors may optionally indicate interest in creating or participating in:

• Panel Discussions — Topic driven sessions featuring multiple experts offering complementary perspectives.

• Technical Forums — Focused, interactive sessions designed for deeper exploration of emerging challenges or cross disciplinary issues.

• Keynote Aligned Sessions — Abstracts that connect to themes introduced by keynote speakers may be selected for integrated programming.

Submission Guidelines

• Abstracts should be 100–200 words, clearly stating the approach, results, and significance. Also, include a 50-100 word Bio.

• Submissions must have technical merit and be free of commercial content.

• Indicate whether the work is best suited for an oral presentation, poster, or one of the novel session formats.

• Include author names, affiliations, and contact information and if presenter is a student.