iMAPS New England Chapter - Big Red

iMAPS New England Chapter

Symposium & Expo


Chapter Meeting

Symposium & Expo



37th Symposium & Expo
thanks to all who participated in this year's

"Get Smart"

Symposium and Expo

Exhibitor List

Technical Program (last update - 17-Apr-2010)
Symposium Technical Program Chair Dr. Wei Han P&G / Gillette

(author presenters are e-mail linked)

Packaging - Session Chairs - David Gibson & Roger Benson

"Analysis of Moisture Permeability of Various Silicone Encapsulants", M. Velderrain, NuSil Technology, 1050 Cindy Lane, Carpinteria, CA,

"Part on Part (PoP) Assembly and Rework", B. Farrell, M. Adl-zarabi, R. Wyman, C. Wang, Benchmark Electronics, 100 Innovative Way, Nashua, NH

"Waferscale Surface Mount Packaging for Ultra-High Brightness LED’s ", T. Boles, M/A-COM Technology Solutions, 1011 Pawtucket Boulevard, Lowell, MA

"Cleaning Advanced Packages Improves Yields", M. Bixenman, Kyzen Corporation, 430 Harding Industrial Drive
Nashville, TN,

"Manufacturing and Reliability Challenges with QFN", G. Caswell, DfR Solutions, 5110 Roanoke Place, College Park, MD,

Surface Mount Technologies - Session Chair - Joe Blemonte - Creyr Innovation

"Topic Expert Failure Analysis, Method and Solutions", M. K. Anselm, Universal Instrument, 33 Broome Corporate Pkwy Conklin, NY,

“Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly”,M. Scalzo , Indium Corporation Of America, 1676 Lincoln Ave, Utica, NY

"Investigation of Solder Paste Print Quality Using Board Claming Systems", R. L. Iyer, R. Mohanty, Speedline Technologies, 16 Forge Parkway, Franklin, MA

"Streamlining the Removal of a RoHS Exemption for Cisco Products", M. Anito, Cisco Systems, 1414 Massachusetts Avenue, Boxborough, MA

"Analysis of Lead Free Materials in Typical Production Conditions and Long Term Use", S. Shina, Ph.D., G. Morose, R. Anderson, R. Farrell, D. Longworth, W. Boger, K. Degan, D. Abbott, D. Pinsky, K. Ebner, A. Sarkhel, M. Miller, L. Feinstein, D. Fragoza, E. Ren, and C. Bickford, UMASS Lowell, Lowell, MA

MEMS/ Nano Materials - Session Chair Jianyu Liang - WPI -  Dr. Bo-Kuai Lai - Harvard

"Low-temperature Nanoadhesive Bonding via Initiated Chemical Vapor Deposition (iCVD) for Polymer-based Microfluidic Devices", J. Xu, S. G. Im, and K. K. Gleason, MIT, 77 Massachusetts Avenue
Cambridge, MA

"Hydrothermal Synthesis of ZnMgO Nanowire Arrays and Annealing Induced Structure Evolution", P. Shimpi, and P. Gao, University of Connecticut, 368 Fairfield Road, Storrs, CT

"Dynamics of 8CB and 10CB Liquid Crystals Inside Multiwall Carbon Nanopipes", N. R. Pradhan, Y. Qiming, J. Liang, and G. S. Iannacchione, Worcester Polytechnic Institute, 100 Institute Road, Worcester, MA

"Biomimetic Membranes for Microfluidic Devices with Vascular Channels for Artificial Lung Assist Devices", R. Sreenivasan, Ph.D., E. Bassett, D. Hoganson, K. Gleason, and J. Vacanti, MIT, 77 Massachusetts Avenue
Cambridge, MA,

"Ti Silicide Nanocrystal Embedded Nonvolatile Memory Device", H. Zhou, B. Li, and J. Liu, UC Riverside, 900 University Ave, Riverside, CA

"SiC Micro/Nano Systems for Harsh Environment and Demanding Applications", L. Chen, Ph.D., Analog Device, 3 Technology Way, Norwood, MA

Workshop: “Competing with High Velocity and Cost Effectiveness: A Supply Chain Perspective”,
by Professor Amy Zeng of Worcester Polytechnic Institute. 10:15 AM in Directors Room.

Thermal Management - Session Chairs - David Saums DS&A LLC, Daniel Blazej

"Thermal Conductivity of Nanofluids", R. Gowda, H. Sun, P. Wang, S. Liu, M. Charmchi,
F. Gao, Z. Gu, B. Budhlall, UMASS Lowell, Lowell, MA

"Pumped Liquid Multiphase Cooling System for a High Brightness LED Projector", J. Marsala, and D. Saums, Thermal Form & Function Inc., 29RR Central St. Manchester-By-The-Sea, MA

"Improved Heat Dissipation and Optical Performance of High-Power LED Packaging with Sintered Nanosilver Die-Attach Material", P. Panaccione, T. Wang, X. Chen, S. Luo, and G. Lu, Luminus Devices, 1100 Technology Park Drive Unit 2, Billerica, MA,

Microwave - Session Chair - John Roman  - Consultant to the Electronics Industry

"Microwave Materials for Millimeter Wave Applications", S. Kennedy, Rogers Corporation, 245 Woodstock Road
Woodstock, CT,

"Reconfigurable RF MEMS Microwave Components on a Flexible, Liquid Crystal Polymer (LCP) Substrate", N. Kingsley, Ph.D., Auriga Microwave, 650 Suffolk Street, Suite 410, Lowell, MA,

"High Reliability MEMS Switches for Wireless Applications", J. Maciel, J. Lampen, and S. Majumder, Radant Mems, 255 Hudson Rd, Stow, MA,

"Manufacturing Integrated Microwave Assemblies: A Case for Vertical Integration", G. Davis , Spectrum Microwave, 165 Cedar Hill St. Marlborough, MA,

Solar Technologies - Session Chair Jeremy Lug - Dymanics Research Corp

"Solar Modules Are Semiconductor Packages Also", A. Rae, TPF Enterprises LLC, Wilson, NY

"Thiophene Based Polymer for Organic Solar Cells", S. Satapathi, R. Anandakathir, L. Li, L. Samuelson, J. Kumar, UMASS Lowell, Lowell, MA

"Overview of the Silicon Solar Cell Manufacturing Process", F. Dimock, BTU International, 23 Esquire Road, N Billerica, MA,

"Aerosol Jet® Printing System for High Speed, Non-contact, Front Side Metallization Helping Improve Efficiencies of Silicon Solar Cells", B. H. King, M. J. O’Reilly, and S. M. Barnes, Optomec, Inc., 3911 Singer NE, Albuquerque, NM,

Poster Session - Session Chair - Ryan Marinis - WPI

"Exploring Nano Scale Convective Heat Transfer of Vertically Aligned Carbon Nanotube Arrays", A. Larsen, R. Whetstone, Worcester Polytechnic Institute, 100 Institute Road, Worcester, MA

"Parametric Design of a Liquid Cooling System for a Computer Chip", C. Wojcik, E. Karam, and B. Pare, Worcester Polytechnic Institute, 100 Institute Road, Worcester, MA

"Preliminary Study to Establish Parameters for Medical Flexible Device at the Center for Advanced Microelectronics manufacturing (CAMM)", D. Yepez, D. Bajkowski, C. Chase, D. Santos, M. Poliks, and B. Sammakia, Binghamton University, Binghamton, NY

"Using Process Capability Analysis to Resistors for Advanced Electronics Manufacturing Applications", G. Zarate, T. Antesberger, F. Egitto, D. Santos, M. Poliks, and B. Sammakia, Binghamton University, Binghamton, NY

"Roll-to-Roll Room Temperature Deposition of ITO and SiO at the Center for Advanced Microelectronics Manufacturing", J. Switzer, D. Santos, Binghamton University, Binghamton, NY

"Improvement of Lead-based Solders until the Development of more Optimized and Sustainable Solutions", P. Crowe, J. Hitchcock, and V. Valencia, Worcester Polytechnic Institute, 100 Institute Road, Worcester, MA

"Vapor Deposited Polymer Thin Coatings for Near Hermetic Packaging", A. J. White, E. S. Handy, N. P. Bansal, H. G. Pryce Lewis, GVD Corporation, 45 Spinelli Place, Cambridge, MA,

"Thermal Management of Ruggedized Notebook with Novel cooling arrangements", JN. Reddy E, J. Suryawanshi, Muthuraj.M, HCL Technologies, J. Thammanna

"Thermal Assessment Studies of Multi Micro Channel Technology for Passive Cooled Mobile Computing Product", J. Suryawanshi, Jagadish T, HCL Technologies J. Thammanna

"Optimal Thermal Design of VTM Channel in High End Servers", B. B. P. Pratap, M. Madasamy, J. Thammanna, HCL Technologies, J. Thammanna

"Thermal Management of 13.5 U Advanced Telecommunications Computing Architecture Equipment", S. Reddy N, M. Madasamy, J. Thammanna, HCL Technologies, J. Thammanna

"Advanced Packaging System: Integration of Thermo-electric Cooler for Digital Movie Camera", A. Srivastav, M. Muthuraj, Jagadish.T, HCL Technologies, J. Thammanna

"Novel Thermal Design of Cold Plate for 8-Core Processors in High End Servers", B. Nalamala, P. P. Binniboyina, Jagadish T, HCL Technologies, J. Thammanna

"Hollow Non-Precious Metallic Nanoparticles as Catalysts for Hydrogen Generation from Sodium Borohydride
Hydrolysis Reaction", Q. Cui, Y. Sha, J. Pelealuw, J. Chen, and Z. Gu, UMASS Lowell, Lowell, MA

"Nanowire Sensor Integration Using Enhanced Dielectrophoretic Assembly", X. Li, Q. Yan, and Z. Gu, UMASS Lowell, Lowell, MA

"Flux Effect on the Melting and Wetting of Tin Nanowire and Nanorod Solderson Si Substrate", F. Gao, K. Rajathurai, Q. Cui, I. NkengforAcha, and Z. Gu, UMASS Lowell, Lowell, MA

Tuesday May 4th 2010
Holiday Inn Boxborough Woods, Boxborough MA

On-Line Registration
Registration opens at 8:00 AM
Expo opens at 9:00 AM

“Official 2010 Symposium Media Sponsors”
Global SMT & Packaging

Global Solar Technology
iMAPS New England Chapter
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